DocumentCode :
1774132
Title :
Power electronics equipments applying novel SiC power semiconductor modules
Author :
Mino, Katsyuki ; Yamada, Ryota ; Kimura, Hiromitsu ; Matsumoto, Yuki
Author_Institution :
Corp. R&D Headquarters, Fuji Electr. Co., Ltd., Hino, Japan
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
1920
Lastpage :
1924
Abstract :
New SiC (Silicon Carbide) power semiconductor modules were developed and applied to the power electronics equipments. 25% of loss in the motor drive inverter is reduced by applying hybrid modules which are composed of conventional Silicon IGBTs (Si-IGBT) and SiC Schottky Barrier Diodes (SiC-SBD). In case of a 20kW inverter for solar photovoltaic (PV) generation, 99% of main circuit efficiency and reduction of size to 25% are realized by applying all-SiC modules using SiC-MOSFETs and SiC-SBDs. Furthermore, we developed a boost chopper using the all-SiC modules for high power PV inverter (Mega solar) application. By applying the boost choppers, the input voltage fluctuation is reduced and 25% of power density is increased.
Keywords :
III-V semiconductors; MOSFET; Schottky barriers; Schottky diodes; choppers (circuits); invertors; motor drives; photovoltaic power systems; power semiconductor diodes; silicon compounds; wide band gap semiconductors; IGBT; MOSFET; SBD; Schottky barrier diode; SiC; all-SiC module; boost chopper; high power PV inverter; hybrid module; loss; motor drive inverter; power 20 kW; power density; power electronics equipment; power semiconductor module; solar photovoltaic generation; voltage fluctuation; Inductors; Insulated gate bipolar transistors; Inverters; MOSFET; Reliability; Silicon carbide; Switches; MOSFET; PV inverter; SiC; motor drive inverter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location :
Hiroshima
Type :
conf
DOI :
10.1109/IPEC.2014.6869847
Filename :
6869847
Link To Document :
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