DocumentCode :
1774180
Title :
Recent development and future prospects of power SiC devices
Author :
Nakamura, T. ; Nakano, Yoshiaki ; Aketa, M. ; Hanada, Toshiki
Author_Institution :
Power Electron. R&D Unit, ROHM Co., Ltd., Kyoto, Japan
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
2074
Lastpage :
2074
Abstract :
Summary form only given. Silicon Carbide (SiC) devices have the potential to reduce energy losses in high power applications. However SiC devices have yet to achieve ideal performance levels. The SiC diodes and MOSFETs with advanced trench structures succeeded in improving performance by reduction of the internal electric field. In addition, transfer mold type power modules using SiC devices demonstrated high temperature operation and high power density.
Keywords :
losses; power MOSFET; power semiconductor diodes; silicon compounds; transfer moulding; wide band gap semiconductors; MOSFET; SiC; advanced trench structure; diode; energy loss reduction; internal electric field reduction; transfer mold type power device module; Indium tin oxide; Resins; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location :
Hiroshima
Type :
conf
DOI :
10.1109/IPEC.2014.6869873
Filename :
6869873
Link To Document :
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