DocumentCode :
1774607
Title :
Insulated metal substrate for power modules using anodic oxide film of aluminum
Author :
Tokuyama, Takeshi ; Kusukawa, Jumpei ; Nakatsu, Kinya
Author_Institution :
Dept. of Power Electron. Syst. Res., Hitachi Res. Lab., Ltd., Hitachi, Japan
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
2904
Lastpage :
2909
Abstract :
To improve the insulation reliability of insulated metal substrates for power modules, we propose an insulated metal substrate that has a porous alumina anodic oxide film along the interface between an aluminum base and resin insulating layer. By having two anodic oxide films, i.e., inorganic and organic acids, compared with conventional substrates, the proposed substrate improves the adhesiveness with the resin insulating layer, resulting in 160% improvement in insulation resistance after 2400 h under atmospheric condition in which the temperature was 85°C and relative humidity was 85%, and 30% improvement in breakdown voltage compared with conventional substrates.
Keywords :
alumina; humidity; insulating thin films; porous materials; reliability; resins; Al; Al2O3; atmospheric condition; breakdown voltage improvement; insulated metal substrate; insulation reliability; insulation resistance; porous alumina anodic oxide film; power module; relative humidity; resin insulating layer; Aluminum; Films; Insulation; Reliability; Resins; Resistance; Substrates; Anodic Oxide Film of Aluminum; Insulated Metal Substrate; Migration; Power Module;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location :
Hiroshima
Type :
conf
DOI :
10.1109/IPEC.2014.6870094
Filename :
6870094
Link To Document :
بازگشت