DocumentCode :
1774609
Title :
A fast-transient-response buck converter with Split-Type III compensation and charge-pump circuit technique
Author :
Jiann-Jong Chen ; Wei-Ting Hsu ; Yu Jih-Hua ; Yuh-Shyan Hwang ; Yu Cheng-Chieh
Author_Institution :
Dept. of Electron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
fYear :
2014
fDate :
18-21 May 2014
Firstpage :
2910
Lastpage :
2913
Abstract :
In order to achieve fast transient response and high efficiency on a CMOS DC-DC buck converter, Split-Type III (ST3) compensation technique and a charge-pump circuit would be proposed and presented in this paper. The proposed buck converter has been fabricated with a TSMC 0.35-μm CMOS 2P4M process. This compensation design tries to add a charge pump circuit into the compensator for improving its transient response time. The operating frequency of the proposed buck converter is 1MHz for input voltage 3.3V and output voltage range 1.0V-2.5V applications. The proposed structure using charge pump circuit technique can achieve fast transient response when load current changes between light load and heavy load, and vice versa. Compared with conventional Type III compensator, ST3 can reduce unnecessary area and power consumption of passive components. Measured result shows that the settling time of the converter output is less than 2 μs for a load current step of 200 mA. Peak power efficiency of 90.8% is obtained at 100 mA load current. The whole chip area is 1.49 mm×1.46 mm(include PADs).
Keywords :
CMOS integrated circuits; power convertors; transient response; CMOS DC-DC buck converter; charge-pump circuit; charge-pump circuit technique; current 200 mA; fast-transient-response buck converter; split-type III compensation technique; voltage 1 V to 2.5 V; voltage 3.3 V; CMOS integrated circuits; Charge pumps; Load modeling; Pulse width modulation; RNA; Switches; Type III compensation; charge-pump circuit; fast transient response; high efficiency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE-ASIA), 2014 International
Conference_Location :
Hiroshima
Type :
conf
DOI :
10.1109/IPEC.2014.6870095
Filename :
6870095
Link To Document :
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