DocumentCode :
1774880
Title :
Measuring and modeling the thermal conductivity of epoxy - Boron nitride nanocomposites
Author :
Tsekmes, I.A. ; Kochetov, R. ; Morshuis, P.H.F. ; Smit, J.J.
Author_Institution :
Intell. Electr. Power Grids, Delft Univ. of Technol., Delft, Netherlands
fYear :
2014
fDate :
1-5 June 2014
Firstpage :
26
Lastpage :
29
Abstract :
In this paper, the thermal conductivity of epoxy - hexagonal boron nitride nanocomposites is investigated. The main goal is to evaluate the effect of particle dispersion and distribution on the thermal conductivity of polymer composites. Therefore, nanocomposites were produced with the use of two different synthesis techniques. Also, 3D models were developed to fit the experimental results on the thermal conductivity of these nanocomposites. The models are mainly based on the ability of surface modified particles to re-organize the polymer matrix in their vicinity. An interfacial layer around the particles is introduced to simulate the affected portion of the polymer matrix. This layer consists of two discrete parts, an inner layer with a constant thickness of a few nm and an outer layer with a dynamic thickness which depends on the interparticle distance and thus, on the filler concentration. Based on the aforementioned assumptions, the model results fit well with the experimental data.
Keywords :
III-V semiconductors; boron compounds; filled polymers; nanocomposites; nanofabrication; nanoparticles; resins; thermal conductivity; wide band gap semiconductors; 3D models; BN; epoxy-hexagonal boron nitride nanocomposites; filler concentration; interfacial layer thickness; interparticle distance; particle dispersion effect; polymer composites; polymer matrix; surface modified particles; thermal conductivity distribution; Atmospheric measurements; Electrical resistance measurement; Particle measurements; Polymers; Resistance; Solvents; Temperature measurement; boron nitride; epoxy; models; nanocomposites; particle dispersion and distribution; thermal conductivity; water uptake;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on
Conference_Location :
Niigata
Type :
conf
DOI :
10.1109/ISEIM.2014.6870711
Filename :
6870711
Link To Document :
بازگشت