DocumentCode :
1774922
Title :
Role of external and internal parameters on the space charge formation in dielectrics
Author :
Reddy, C.C. ; Chahal, J.S. ; Gupta, Arpan ; Tiwana, A.P.S.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol. Ropar, Rupnagar, India
fYear :
2014
fDate :
1-5 June 2014
Firstpage :
101
Lastpage :
103
Abstract :
Space charge accumulation in dielectrics is a hot topic among dielectric research group for more than a decade. The charge accumulation has been observed to be of various types like homo, hetero and packet charge, etc. Volume resistivity and its non-uniform distribution has been suspected for formation of space charge. The author has recently shown that apart from volume resistivity, diffusion coefficient plays a significant role on the type of charge formation. Several issues still remain unaddressed. In the current paper, the author investigates the role of internal properties like volume resistivity and diffusion and external parameters like boundary conditions or condition of electrodes on the formation of space charge more clearly. It has been shown that manipulation in any of the parameters can alter the type of charge formation. It shows a direction for investigation of new insulation materials with suitable material properties and suitable boundaries for minimizing space charge effects. Interesting results have been presented that seem to have not been presented earlier.
Keywords :
dielectric materials; diffusion; electrical resistivity; space charge; boundary conditions; dielectrics; diffusion coefficient; electrodes condition; hetero charge; homo charge; packet charge; space charge effects; space charge formation; volume resistivity; Current density; Degradation; Equations; Materials; Mathematical model; conduction; electric field; homo charge; space charge; volume resistivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2014 International Symposium on
Conference_Location :
Niigata
Type :
conf
DOI :
10.1109/ISEIM.2014.6870730
Filename :
6870730
Link To Document :
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