DocumentCode :
1775784
Title :
Hierarchical traffic shaping and frame packing to reduce bandwidth utilization in the AFDX
Author :
Ayed, H. ; Mifdaoui, A. ; Fraboul, C.
Author_Institution :
ISAE, Univ. of Toulouse, Toulouse, France
fYear :
2014
fDate :
18-20 June 2014
Firstpage :
77
Lastpage :
86
Abstract :
The increasing complexity and heterogeneity of avionic networks make resource savings a challenging task to guarantee easy incremental design during the lifetime of an aircraft. In this paper, we focus on the optimization of interconnection devices for multi-cluster avionic networks, called Remote Data Concentrators (RDC), and especially for the CAN-AFDX network. The design of this optimized RDC device consists of implementing frame packing strategies to manage upstream (sensors) flows to improve bandwidth utilization in the AFDX; and a Hierarchical Traffic Shaping (HTS) algorithm to control downstream (actuators) flows to guarantee bandwidth isolation on CAN. Schedulability analysis integrating the effects of these new mechanisms is detailed and validated. Furthermore, a heuristic approach to tune the HTS parameters within the RDC device is proposed to reduce as much as possible bandwidth utilization in the AFDX, while ensuring flow schedulability. Our performance analysis conducted on a realistic avionic case study demonstrates the efficiency of the optimized RDC device to reduce bandwidth utilization in the AFDX, compared to the basic device currently implemented in avionics.
Keywords :
avionics; controller area networks; CAN-AFDX network; avionic networks; avionics full duplex switched Ethernet network; bandwidth isolation; bandwidth utilization reduction; frame packing; hierarchical traffic shaping; interconnection devices; multicluster avionic network; remote data concentrator; Aerospace electronics; Bandwidth; Data buses; Delays; High-temperature superconductors; Interference; Servers; AFDX; CAN; Frame Packing; Hierarchical Traffic Shaping; Optimization process; RDC; Schedulability analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Embedded Systems (SIES), 2014 9th IEEE International Symposium on
Conference_Location :
Pisa
Type :
conf
DOI :
10.1109/SIES.2014.6871190
Filename :
6871190
Link To Document :
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