• DocumentCode
    1775877
  • Title

    A CMOS envelope tracking power amplifier for 4G LTE mobile terminal applications

  • Author

    Junghyun Ham ; Youngoo Yang

  • Author_Institution
    Dept. of Electr., Electron. & Comput. Eng., Sungkyunkwan Univ., Suwon, South Korea
  • fYear
    2014
  • fDate
    26-29 July 2014
  • Firstpage
    1169
  • Lastpage
    1171
  • Abstract
    An envelope tracking power amplifier (ET PA) using a standard CMOS process for the 3GPP long-term evolution mobile terminals is presented. An efficiency of the CMOS power amplifier for the modulated signals can be improved combining with a highly efficient and wideband CMOS bias modulator. The CMOS PA has a two-stage differential common-source structure for high gain and large voltage swing. The bias modulator has a hybrid structure which consists of a linear stage and a switching stage. The variable load condition according to the envelope signal level is taken into account for the bias modulator design. By applying the bias modulator to the power amplifier, the ET PA delivers a PAE of 41.7 % at an average output power of 24 dBm, which is 5.3 % points higher than that of the power amplifier alone at the same average output power and linearity.
  • Keywords
    4G mobile communication; CMOS integrated circuits; Long Term Evolution; 3GPP long-term evolution mobile terminals; 4G LTE mobile terminal applications; CMOS envelope tracking power amplifier; bias modulator design; envelope signal level; hybrid structure; large voltage swing; linear stage; modulated signals; standard CMOS process; switching stage; two-stage differential common-source structure; variable load condition; wideband CMOS bias modulator; CMOS integrated circuits; Gain; Modulation; Power amplifiers; Power generation; Switches; CMOS power amplifier (PA); Envelope tracking; bias modulator; hybrid buck converter; long term evlution (LTE); power amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4799-4355-5
  • Type

    conf

  • DOI
    10.1109/APCAP.2014.6992721
  • Filename
    6992721