Title :
PCB pad design for board to board SMP connector
Author :
Anwang Xu ; Zhuo Li ; Jian Yan ; Jianye Liu
Author_Institution :
Key Lab. of Radar Imaging & Microwave Photonics, Nanjing Univ. of Aeronaut. & Astronaut. Nanjing, Nanjing, China
Abstract :
The design of printed circuit board (PCB) pad for SMP connector is presented. A detailed design and parameterization study are performed using HFSS, a commercial finite element tool. The PCB pad for the vertical SMP connector and surface mounted SMP connector are optimized. According to the simulation result, the return loss and insertion loss for SMP-to-microstrip transitions are better than 26 dB and 0.12 dB respectively from DC to 6 GHz, and the return loss and insertion loss for SMP-to-coplanar waveguide (CPW) transitions are better than 10 dB and 0.7 dB respectively up to 26.5 GHz.
Keywords :
coplanar waveguides; finite element analysis; printed circuit design; HFSS; PCB pad design; SMP-to-coplanar waveguide; SMP-to-microstrip transitions; board to board SMP connector; finite element tool; frequency 26.5 GHz; frequency 6 GHz; insertion loss; printed circuit board pad design; return loss; surface mounted SMP connector; Connectors; Coplanar waveguides; Insertion loss; Microstrip; Simulation; Surface waves; Waveguide transitions;
Conference_Titel :
Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4799-4355-5
DOI :
10.1109/APCAP.2014.6992748
