Title :
A novel planar interconnection structure with substrate integrated waveguide
Author :
Hui Zhang ; Wei Hong ; Peng Chen ; Hongjun Tang
Author_Institution :
State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
Abstract :
In this paper, a novel planar interconnection method with substrate integrated waveguide (SIW) is presented. This method can be used as planar microwave structure interconnection in millimeter wave band. It also provides a quick assembly and disassembly of interconnection with different modules without any soldering or wire bonding operations. A W-band SIW interconnection structure is simulated and experimented. The simulated and measured results show the SIW interconnection structure has a high constituency with the complete board on transmission and reflection properties.
Keywords :
interconnections; microstrip lines; substrate integrated waveguides; W-band SIW interconnection structure; millimeter wave band; planar interconnection structure; planar microwave structure interconnection; quick assembly interconnection; quick disassembly interconnection; substrate integrated waveguide; Integrated circuit interconnections; Microstrip; Millimeter wave technology; Splicing; Substrates; Waveguide transitions; Interconnection; SIW; Splicing; microstrip; substrate integrated waveguide; transition;
Conference_Titel :
Antennas and Propagation (APCAP), 2014 3rd Asia-Pacific Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4799-4355-5
DOI :
10.1109/APCAP.2014.6992758
