• DocumentCode
    1776241
  • Title

    Integrating power semiconductor device courses in electrical engineering curricula, a review paper

  • Author

    Abdel-Motaleb, Ibrahim M.

  • Author_Institution
    Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
  • fYear
    2014
  • fDate
    5-7 June 2014
  • Firstpage
    524
  • Lastpage
    529
  • Abstract
    The skills needed to build the next-generation of power semiconductor devices and to integrate them into power electronic systems require proper education and training of engineering students, both at the undergraduate and graduate levels. To assess the current state of power electronics education, a study of curricular offering in power electronics in the U.S. universities is conducted. The study shows that there is a lack of course offering in semiconductor power devices with a lack of critical topics such as thermal management, temperature effects, reliability, power packaging, modeling, systems integration, and failure analysis. To remedy these deficiencies, new power electronics tracks/concentrations for undergraduate and graduate programs are proposed. The proposed curricular modifications are designed to be rigorous to meet the future needs of the power electronic industry, but flexible enough to be easily adopted by different institutions.
  • Keywords
    electronic engineering education; further education; power semiconductor devices; US universities; course offering; curricular modifications; electrical engineering curricula; engineering students; failure analysis; graduate levels; graduate programs; power electronic industry; power electronics concentrations; power electronics education; power packaging; power semiconductor device courses; reliability; systems integration; temperature effects; thermal management; undergraduate levels; undergraduate programs; Educational institutions; Laboratories; Physics; Power semiconductor devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro/Information Technology (EIT), 2014 IEEE International Conference on
  • Conference_Location
    Milwaukee, WI
  • Type

    conf

  • DOI
    10.1109/EIT.2014.6871818
  • Filename
    6871818