DocumentCode :
1776241
Title :
Integrating power semiconductor device courses in electrical engineering curricula, a review paper
Author :
Abdel-Motaleb, Ibrahim M.
Author_Institution :
Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
fYear :
2014
fDate :
5-7 June 2014
Firstpage :
524
Lastpage :
529
Abstract :
The skills needed to build the next-generation of power semiconductor devices and to integrate them into power electronic systems require proper education and training of engineering students, both at the undergraduate and graduate levels. To assess the current state of power electronics education, a study of curricular offering in power electronics in the U.S. universities is conducted. The study shows that there is a lack of course offering in semiconductor power devices with a lack of critical topics such as thermal management, temperature effects, reliability, power packaging, modeling, systems integration, and failure analysis. To remedy these deficiencies, new power electronics tracks/concentrations for undergraduate and graduate programs are proposed. The proposed curricular modifications are designed to be rigorous to meet the future needs of the power electronic industry, but flexible enough to be easily adopted by different institutions.
Keywords :
electronic engineering education; further education; power semiconductor devices; US universities; course offering; curricular modifications; electrical engineering curricula; engineering students; failure analysis; graduate levels; graduate programs; power electronic industry; power electronics concentrations; power electronics education; power packaging; power semiconductor device courses; reliability; systems integration; temperature effects; thermal management; undergraduate levels; undergraduate programs; Educational institutions; Laboratories; Physics; Power semiconductor devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electro/Information Technology (EIT), 2014 IEEE International Conference on
Conference_Location :
Milwaukee, WI
Type :
conf
DOI :
10.1109/EIT.2014.6871818
Filename :
6871818
Link To Document :
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