Influence of overall dimensions and materials of a switchboard on the thermal field distribution

Author

Hadzhiev, Ivan ; Malamov, Dian ; Yatchev, Ivan

Author_Institution

Dept. of Electr. Eng., Tech. Univ. of Sofia, Plovdiv, Bulgaria

fYear

2014

fDate

29-31 May 2014

Firstpage

1

Lastpage

4

Abstract

This paper employs a computer model for investigation of the thermal field in a low voltage (LV) switchboard. The model has been synthesized in the software product Comsol. The thermal field has been modelled taking into account the thermodynamic processes and heat transfer by radiation in the volume of the LV switchboard. Comparison has been drawn between the results, obtained from the model and the results of the experiment. Results, concerning the influence of both the volume and the material of the enclosure on the switchboard heating have been obtained by means of the computer model.

Keywords

finite element analysis; heat transfer; low-power electronics; power engineering computing; switched mode power supplies; switching circuits; thermodynamics; LV switchboard; computer model; heat transfer; low voltage switchboard; software product Comsol; switchboard dimensions influence; switchboard heating; switchboard materials influence; thermal field distribution; thermodynamic process; Circuit breakers; Computational modeling; Conductivity; Finite element analysis; Heating; Mathematical model; Switches; computer model; low voltage switchboard; thermal field;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Apparatus and Technologies (SIELA), 2014 18th International Symposium on

Conference_Location

Bourgas

Print_ISBN

978-1-4799-5816-0

Type

conf

DOI

10.1109/SIELA.2014.6871860

Filename

6871860