DocumentCode :
1776702
Title :
Scalable normally-off MIS-HEMT using fluorine implantation below the channel
Author :
Hamady, Saleem ; Morancho, Frederic ; Beydoun, Bilal ; Austin, Patrick ; Gavelle, Mathieu
Author_Institution :
LAAS, Toulouse, France
fYear :
2014
fDate :
18-20 June 2014
Firstpage :
124
Lastpage :
127
Abstract :
A new normally-off Metal-Insulator-Semiconductor High-Electron-Mobility-Transistor (MIS-HEMT) is proposed. The design is based on the implantation of fluorine ions in the GaN layer below the gate electrode under the AlGaN/GaN interface. Sensitivity analyses are carried out, showing the effects of the fluorine concentration and the thickness of the insulator on the threshold voltage. The limitations and scalability of this technique are pointed out.
Keywords :
III-V semiconductors; MIS devices; aluminium compounds; fluorine; gallium compounds; high electron mobility transistors; ion implantation; sensitivity analysis; wide band gap semiconductors; AlGaN-GaN; fluorine concentration; fluorine ion implantation; gallium nitride layer; gate electrode; insulator thickness; normally-off MIS-HEMT scalability; normally-off metal-insulator-semiconductor high-electron-mobility-transistor; sensitivity analysis; threshold voltage; Aluminum gallium nitride; Gallium nitride; HEMTs; Insulators; Logic gates; MODFETs; Threshold voltage; Fluorine implantation below the channel; Metal Insulator Semiconductor High Electron Mobility Transistor (MIS-HEMT); TCAD simulation; normally-off; wide bandgap devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM), 2014 International Symposium on
Conference_Location :
Ischia
Type :
conf
DOI :
10.1109/SPEEDAM.2014.6872054
Filename :
6872054
Link To Document :
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