Title :
The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties
Author :
Maj, Cezary ; Zajac, Piotr ; Szermer, Michal ; Napieralski, Andrzej
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland
Abstract :
The bonding is one of the common processes performed during MEMS fabrication. It allows creating advanced microstructures and specific encapsulation. However, this process induces a residual stress into the structure as the annealing process is required. In this paper the bonding of silicon and pyrex glass is taken into account as these materials have different coefficients of thermal expansion. We analyze the bonding process performed in optimal temperature that induces residual stress as small as possible. The simulations show the influence of residual stress on membrane deflection in typical temperature range of operation.
Keywords :
annealing; elemental semiconductors; encapsulation; glass; internal stresses; membranes; microfabrication; micromechanical devices; silicon; thermal expansion; wafer bonding; MEMS fabrication; MEMS membrane properties; Si; advanced microstructures; annealing process; anodic wafer bonding process; encapsulation; membrane deflection; optimal temperature; pyrex glass; residual stress; silicon bonding; thermal expansion coefficients; Bonding; Micromechanical devices; Performance evaluation; Residual stresses; Silicon; Temperature distribution; MEMS; bonding; membrane; residual stress;
Conference_Titel :
Mixed Design of Integrated Circuits & Systems (MIXDES), 2014 Proceedings of the 21st International Conference
Conference_Location :
Lublin
Print_ISBN :
978-83-63578-03-9
DOI :
10.1109/MIXDES.2014.6872162
