• DocumentCode
    1776929
  • Title

    2.5 Gbit/s compact transimpedance amplifier using active inductor in 130nm CMOS technology

  • Author

    Atef, Mohamed ; Abd-elrahman, Diaa

  • Author_Institution
    Electr. Eng. Dept., Assiut Univ., Assiut, Egypt
  • fYear
    2014
  • fDate
    19-21 June 2014
  • Firstpage
    103
  • Lastpage
    107
  • Abstract
    This paper presents the analysis and design of a 2.5 Gbit/s transimpedance amplifier (TIA) realized in 130 nm CMOS technology. The proposed TIA uses a common source (CS) amplifier with active inductive peaking (AP-TIA). The TIA is followed by a post amplifier and an output driver to provide an interface to the measurement setup. The post layout simulation demonstrates that the TIA achieves 46.16 dBΩ transimpedance gain with 2 GHz bandwidth for 2 pF input capacitance including the photodiode, ESD, and pad capacitance. The integrated input referred noise current is 1.062 μArms. The complete optical receiver has 76.78 dBΩ transimpedance gain, and optical sensitivity of -21 dBm for BER= 10-12 at data rate of 2.5 Gbit/s. The TIA alone consumes 5.4 mW whereas the total power consumption of the complete optical receiver is 47.3 mW for 1.8 V single supply voltage.
  • Keywords
    CMOS analogue integrated circuits; UHF amplifiers; UHF integrated circuits; inductors; integrated circuit layout; operational amplifiers; optical receivers; AP-TIA; CMOS technology; CS amplifier; ESD; active inductive peaking; bandwidth 2 GHz; bit rate 2.5 Gbit/s; capacitance 2 pF; common source amplifier; compact transimpedance amplifier; current 1.062 muA; integrated input referred noise current; optical receiver; pad capacitance; photodiode; post layout simulation; power 47.3 mW; power 5.4 mW; size 130 nm; voltage 1.8 V; Bandwidth; CMOS integrated circuits; CMOS technology; Capacitance; Gain; Noise; Optical receivers; active inductor; optical receiver; transimpedance amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits & Systems (MIXDES), 2014 Proceedings of the 21st International Conference
  • Conference_Location
    Lublin
  • Print_ISBN
    978-83-63578-03-9
  • Type

    conf

  • DOI
    10.1109/MIXDES.2014.6872165
  • Filename
    6872165