Title :
Thermal issues in microelectronics [breaker page]
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Mixed Design of Integrated Circuits & Systems (MIXDES), 2014 Proceedings of the 21st International Conference
Conference_Location :
Lublin
Print_ISBN :
978-83-63578-03-9
DOI :
10.1109/MIXDES.2014.6872200
