DocumentCode :
1777169
Title :
Enhancement-mode Al2O3/InAlN/GaN MOS-HEMT on Si with high drain current density 0.84 A/mm and threshold voltage of +1.9 V
Author :
Freedsman, Joseph J. ; Watanabe, Atsuyori ; Egawa, T.
Author_Institution :
Res. Center for Nano-Device & Syst., Nagoya Inst. of Technol., Nagoya, Japan
fYear :
2014
fDate :
22-25 June 2014
Firstpage :
49
Lastpage :
50
Abstract :
In the last decade, AlGaN/GaN based Enhancement-mode (E-mode) devices on Si substrate have been studied extensively [1-3]. In spite of improvements in the threshold voltage (Vth), the AlGaN/GaN E-mode devices could not show high drain current density (Idsmax), which is highly desirable for automotive applications [4, 5]. Alternatively, InAlN/GaN based E-mode devices are preferred for high-temperature and high-speed applications. A few research groups have demonstrated InAlN/GaN based E-mode devices mainly on SiC and sapphire substrates [6-9]. The main focus in this work is to demonstrate high performance InAlN/GaN based E-Mode metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMT) on low cost Si.
Keywords :
MOSFET; alumina; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; sapphire; silicon compounds; Al2O3-InAlN-GaN; AlGaN-GaN; E-mode devices; SiC; automotive applications; enhancement-mode MOS-HEMT; high drain current density; high-speed applications; high-temperature applications; metal-oxide-semiconductor high-electron-mobility transistors; sapphire substrates; threshold voltage; voltage 1.9 V; Aluminum gallium nitride; Aluminum oxide; Electron devices; Gallium nitride; Logic gates; Silicon; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2014 72nd Annual
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4799-5405-6
Type :
conf
DOI :
10.1109/DRC.2014.6872294
Filename :
6872294
Link To Document :
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