DocumentCode :
1777275
Title :
Topological surface state transport and current saturation in topological insulator nanoribbons field effect transistors
Author :
Jauregui, Luis A. ; Pettes, Michael T. ; Li Shi ; Chen, Yongpin P.
Author_Institution :
Purdue Univ., West Lafayette, IN, USA
fYear :
2014
fDate :
22-25 June 2014
Firstpage :
167
Lastpage :
168
Abstract :
Topological insulators (TIs) are a new class of quantum matter, with an insulating bulk, where electrons on the surface behave as massless Dirac fermions as in graphene [1,2]. However, in contrast with graphene, the surface state of TIs is topologically protected against non-magnetic disorder or lattice defects. This topological protection, unique to TIs, originates from the spin locked to the Fermi momentum (“spin-helical Dirac electrons”, where backscattering is forbidden). Consequently, TI nanowire (NW) devices may outperform conventional semiconductor NWs or graphene nanoribbon (NR) devices that may suffer from backscattering. However, one of the main limitations to explore device applications in TIs was its large bulk conductance, shunting the surface conduction and also impeding effective gate tuning.
Keywords :
field effect transistors; nanoribbons; nanowires; surface states; topological insulators; Fermi momentum; TI NW device; TI nanowire device; TI surface state; bulk conductance; current saturation; effective gate tuning; graphene nanoribbon device; insulating bulk; lattice defects; massless Dirac fermions; nonmagnetic disorder; semiconductor NW device; spin lock; spin-helical Dirac electrons; surface conduction; topological insulator nanoribbon field effect transistors; topological protection; topological surface state transport; Educational institutions; Electric fields; Field effect transistors; Graphene; Phonons; Substrates; Topological insulators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2014 72nd Annual
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4799-5405-6
Type :
conf
DOI :
10.1109/DRC.2014.6872350
Filename :
6872350
Link To Document :
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