DocumentCode :
1777338
Title :
Growth process for high performance of InGaAs MOSFETs
Author :
Miyamoto, Yutaka ; Kanazawa, Toru ; Yonai, Yoshiharu ; Ohsawa, Kazuto ; Mishima, Yuuki ; Irisawa, T. ; Oda, Masaomi ; Tezuka, Taro
Author_Institution :
Dept. Phys. Electron., Tokyo Inst. Technol., Tokyo, Japan
fYear :
2014
fDate :
22-25 June 2014
Firstpage :
227
Lastpage :
228
Abstract :
To obtain high performance in nMOSFETs, the introduction of high-mobility channel material such as InGaAs is a promising approach. However, the required source doping concentration for a high driving current cannot be obtained by ion implantation in InGaAs. One method of achieving a heavily doped source in III-V semiconductor MOSFETs is by growing an epitaxial source/drain structure.1 For realizing such a source, we used a regrown InGaAs source2,3 and an InP source.4 The regrown sources are also important for high current drivability of 3D or multi-gate devices. The other advantage of regrowth in multi-gate devices is a smooth surface for high electron mobility.5 In this report, we describe the growth process for high-performance InGaAs MOSFETs.
Keywords :
III-V semiconductors; MOSFET; electron mobility; epitaxial growth; gallium arsenide; indium compounds; semiconductor doping; wide band gap semiconductors; 3D devices; III-V semiconductor; InGaAs; InP; epitaxial source-drain structure; growth process; heavily doped source; high current drivability; high electron mobility; high-mobility channel material; multigate devices; nMOSFET; source doping concentration; Epitaxial growth; Epitaxial layers; Indium gallium arsenide; Indium phosphide; Logic gates; MOSFET; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2014 72nd Annual
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4799-5405-6
Type :
conf
DOI :
10.1109/DRC.2014.6872380
Filename :
6872380
Link To Document :
بازگشت