• DocumentCode
    1777381
  • Title

    Thin-film circuits for scalable interfacing between large-area electronics and CMOS ICs

  • Author

    Moy, Tiffany ; Rieutort-Louis, Warren ; Yingzhe Hu ; Liechao Huang ; Sanz-Robinson, Josue ; Sturm, James C. ; Wagner, Steffen ; Verma, Naveen

  • Author_Institution
    Dept. of Electr. Eng., Princeton Univ., Princeton, NJ, USA
  • fYear
    2014
  • fDate
    22-25 June 2014
  • Firstpage
    271
  • Lastpage
    272
  • Abstract
    Hybrid systems based on large-area electronics (LAE) and CMOS ICs aim to exploit the complementary strengths of the two technologies: the scalability of LAE for forming interconnects and transducers (for sensing and energy harvesting), and the energy efficiency of CMOS for instrumentation and computation. The viability of large-scale systems depends on maximizing the robustness and minimizing the number of interfaces between the LAE and CMOS domains. To maximize robustness, inductive and capacitive coupling has been explored, avoiding the need for metallurgical bonding [1]. To minimize the number of interfaces, a method to access and readout individual sensors via minimal coupling channels, is crucial. In this abstract, we present a thin-film transistor (TFT) based scanning circuit that requires only three capacitively-coupled control signals from the IC to sequentially access an arbitrarily large number of LAE sensors, enabling a single readout interface (Fig. 1). A key attribute of the presented circuit is the low power consumption, which remains nearly constant even as the number of sensors scales.
  • Keywords
    CMOS integrated circuits; readout electronics; thin film circuits; thin film sensors; thin film transistors; transistor circuits; CMOS ICs; LAE scalability; LAE sensors; TFT based scanning circuit; capacitive coupling; capacitively-coupled control signals; energy efficiency; hybrid systems; inductive coupling; interconnects; large-area electronics; large-scale systems; low power consumption; metallurgical bonding; minimal coupling channels; single readout interface; thin-film circuits; thin-film transistor; transducers; CMOS integrated circuits; Clocks; Frequency conversion; Power demand; Sensors; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2014 72nd Annual
  • Conference_Location
    Santa Barbara, CA
  • Print_ISBN
    978-1-4799-5405-6
  • Type

    conf

  • DOI
    10.1109/DRC.2014.6872402
  • Filename
    6872402