Title :
Adopting multiview pixel mapping for enhancing quality of holoscopic 3D scene in parallax barriers based holoscopic 3D displays
Author :
Swash, M.R. ; Abdulfatah, O. ; Alazawi, E. ; Kalganova, T. ; Cosmas, J.
Author_Institution :
Sch. of Eng. & Design, Brunel Univ., Uxbridge, UK
Abstract :
The Autostereoscopic multiview 3D Display is robustly developed and widely available in commercial markets. Excellent improvements are made using pixel mapping techniques and achieved an acceptable 3D resolution with balanced pixel aspect ratio in lens array technology. This paper proposes adopting multiview pixel mapping for enhancing quality constructed holoscopic 3D scene in parallax barriers based holoscopic 3D displays achieving great results. The Holoscopic imaging technology mimics the imaging system of insects, such as the fly, utilizing a single camera, equipped with a large number of micro-lenses, to capture a scene, offering rich parallax information and enhanced 3D feeling without the need of wearing specific eyewear. In addition pixel mapping and holoscopic 3D rendering tools are developed including a custom built holoscopic 3D displays to test the proposed method and carry out a like-to-like comparison.
Keywords :
image enhancement; lenses; rendering (computer graphics); adopting multiview pixel mapping; autostereoscopic multiview 3D Display; balanced pixel aspect ratio; commercial markets; enhancing quality; holoscopic 3D displays; holoscopic 3D rendering tools; holoscopic 3D scene; holoscopic imaging technology mimics; imaging system; lens array technology; multiview pixel mapping; parallax barriers; parallax information; pixel mapping techniques; specific eyewear; Arrays; Cameras; Image resolution; Lenses; Rendering (computer graphics); Three-dimensional displays; 3D; 3D Display; 3DTV; Autostereoscopic; Display; Holoscopic; Integral image; Lenticular; Parallax barrier; Pixel mapping; Rendering; Unidirectional; lens array; viewpoint;
Conference_Titel :
Broadband Multimedia Systems and Broadcasting (BMSB), 2014 IEEE International Symposium on
Conference_Location :
Beijing
DOI :
10.1109/BMSB.2014.6873560