DocumentCode
1778971
Title
Research on Modeling Techniques of Testability Evaluation Based on Modelica
Author
Chunling Yang ; Xiaodi Gu ; Min Zhu ; Mingqi Li
Author_Institution
Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
fYear
2014
fDate
18-20 Sept. 2014
Firstpage
590
Lastpage
594
Abstract
Since testability physical verification has many shortcomings, such as high risk, difficulty in fault injection, long verification period, high verification cost and so on. Testability nonphysical verification acquires more and more attentions. While most of the traditional testability evaluation models can only describe the relationship of signals, faults and tests qualitatively, they have little quantitative information and this may cause significant deviation between verification result and the real one. So after doing research on the requirements of verification evaluation to virtual Prototypes, a testability evaluation modeling techniques was proposed based on Modelica in this work and the Function-Structure-Fault-Test-Circumstance Model was also defined and described mathematically herein. Additionally, a testability evaluation model of a data collector was built in this paper. By comparing the numerical result with that of the testability physical verification, the following conclusion can be obtained: With sufficient modeling information, testability evaluation model can be built accurately by using the method put forward in this paper.
Keywords
fault diagnosis; test equipment; Modelica; function-structure-fault-test circumstance model; testability evaluation models; testability physical verification; Analytical models; Circuit faults; Computational modeling; Data models; Integrated circuit modeling; Mathematical model; Object oriented modeling; Modelica; modeling; testability evaluation; testability evaluation model;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement, Computer, Communication and Control (IMCCC), 2014 Fourth International Conference on
Conference_Location
Harbin
Print_ISBN
978-1-4799-6574-8
Type
conf
DOI
10.1109/IMCCC.2014.126
Filename
6995096
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