DocumentCode
1779287
Title
Chlorine- and Fluorine-based dry etching of Germanium-Tin
Author
Yuan Dong ; Dian Lei ; Xin Xu ; Wei Wang ; Yee-Chia Yeo
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear
2014
fDate
2-4 June 2014
Firstpage
99
Lastpage
100
Abstract
Cl- and F- based dry etching of Ge1-xSnx were presented in this work. High selectivity of Ge1-xSnx over Ge can be achieved by F-based dry etching. This is caused by the formation of a thin nonvolatile SnFx layer at Ge1-xSnx surface. Addition of O2 to CF4 can enhance the selectivity of F-based dry etching, but with an increase of surface roughness of Ge1-xSnx samples.
Keywords
chlorine; etching; fluorine; germanium alloys; tin alloys; Ge1-xSnx; chlorine-based dry etching; etch rate selectivity; etching conditions; fluorine-based dry etching; nonvolatile etching products; Decision support systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2014 7th International
Conference_Location
Singapore
Print_ISBN
978-1-4799-5427-8
Type
conf
DOI
10.1109/ISTDM.2014.6874686
Filename
6874686
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