DocumentCode
1779295
Title
Dual-core spot-size converter with tapered cladding layer designed for high-efficiency mode coupling to InP-based deep-ridge waveguide
Author
Kitamura, Takamitsu ; Kono, Naoya ; Yagi, Hideki ; Ishikawa, Tsutomu ; Horino, Kazuhiko ; Kimura, Daisuke ; Seki, Morihiro ; Yoneda, Yoshihiro ; Uesaka, Katsumi ; Shoji, Hajime
Author_Institution
Transm. Devices R & D Labs., Ind., Ltd., Yokohama, Japan
fYear
2014
fDate
12-16 Oct. 2014
Firstpage
280
Lastpage
281
Abstract
We demonstrated an InP-based dual-core spot-size converter with the tapered cladding layer designed for high-efficiency mode coupling between two cores. It gives the wider dry-etching process tolerances, which provides uniform and low loss coupling properties.
Keywords
III-V semiconductors; etching; indium compounds; optical modulation; optical waveguides; ridge waveguides; InP; InP-based deep-ridge waveguide; dry-etching process; dual-core spot-size converter; high-efficiency mode coupling; loss coupling properties; tapered cladding layer; Couplings; Indium phosphide; Modulation; Optical coupling; Optical device fabrication; Optical losses; Optical waveguides; InP-based modulator; deep-ridge waveguide; dual-core spot-size converter;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics Conference (IPC), 2014 IEEE
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/IPCon.2014.6995353
Filename
6995353
Link To Document