Title :
Dual-core spot-size converter with tapered cladding layer designed for high-efficiency mode coupling to InP-based deep-ridge waveguide
Author :
Kitamura, Takamitsu ; Kono, Naoya ; Yagi, Hideki ; Ishikawa, Tsutomu ; Horino, Kazuhiko ; Kimura, Daisuke ; Seki, Morihiro ; Yoneda, Yoshihiro ; Uesaka, Katsumi ; Shoji, Hajime
Author_Institution :
Transm. Devices R & D Labs., Ind., Ltd., Yokohama, Japan
Abstract :
We demonstrated an InP-based dual-core spot-size converter with the tapered cladding layer designed for high-efficiency mode coupling between two cores. It gives the wider dry-etching process tolerances, which provides uniform and low loss coupling properties.
Keywords :
III-V semiconductors; etching; indium compounds; optical modulation; optical waveguides; ridge waveguides; InP; InP-based deep-ridge waveguide; dry-etching process; dual-core spot-size converter; high-efficiency mode coupling; loss coupling properties; tapered cladding layer; Couplings; Indium phosphide; Modulation; Optical coupling; Optical device fabrication; Optical losses; Optical waveguides; InP-based modulator; deep-ridge waveguide; dual-core spot-size converter;
Conference_Titel :
Photonics Conference (IPC), 2014 IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/IPCon.2014.6995353
