DocumentCode :
1779305
Title :
Spin lifetime in strained silicon films
Author :
Sverdlov, Viktor ; Osintsev, Dmitri ; Selberherr, Siegfried
Author_Institution :
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear :
2014
fDate :
2-4 June 2014
Firstpage :
57
Lastpage :
58
Abstract :
The outstanding increase in performance of integrated circuits is facilitated and supported by the continuous miniaturization of CMOS components; however, growing technological challenges [1] and soaring costs are gradually expected to bring scaling to an end. This puts foreseeable limitations to the future performance increase, and research on alternative technologies and computational principles becomes paramount. The MOSFET, the main building block of modern integrated circuits, fundamentally operates by employing the charge degree of freedom of an electron. The electron charge interacts with the electrostatic field induced by the gate. The transistor channel can be closed or opened by creating or removing a gate induced potential barrier. Another intrinsic electron property, the electron spin, attracts much attention as a possible candidate for complimenting or even replacing the charge in future electron devices. The electron spin state is characterized by the two possible spin projections on a given axis and thus has potential in digital information processing. In addition, the small amount of energy needed to invert the spin orientation is attractive for low power applications.
Keywords :
CMOS integrated circuits; MOSFET; elemental semiconductors; internal stresses; semiconductor thin films; silicon; spin polarised transport; CMOS; MOSFET; Si; digital information processing; electron charge; electron spin state; electrostatic field; integrated circuits; spin lifetime; spin orientation; strained silicon films; transistor channel; Decision support systems; Electronic mail; Films; Rough surfaces; Silicon; Strain; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon-Germanium Technology and Device Meeting (ISTDM), 2014 7th International
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-5427-8
Type :
conf
DOI :
10.1109/ISTDM.2014.6874695
Filename :
6874695
Link To Document :
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