DocumentCode
1779586
Title
Development of a low-cost packaging for MEMS pressure sensors
Author
Conte Ayala Penalver, Diego ; Furlan, Humber ; Amorim Fraga, Mariana
Author_Institution
Centro Paula Souza (CEETEPS), Mestrado Profissional em Gestao e Tecnol. em Sist. Produtivos, Sao Paulo, Brazil
fYear
2014
fDate
15-18 Oct. 2014
Firstpage
1
Lastpage
3
Abstract
Considerable research efforts have been devoted to the development of MEMS sensor packaging based on different material types (ceramic, plastic and metal). In this work, we describe the design, fabrication and test of a metal packaging with high reliability and low cost. The novelty of our research is on the packaging assembly by mechanical interference replacing the expensive plasma welding process that is used commonly in the development of traditional metal packaging.
Keywords
assembling; electronics packaging; interference; microfabrication; microsensors; pressure sensors; reliability; MEMS pressure sensor; ceramic material; mechanical interference; metal material; metal packaging assembly; plasma welding process; plastic material; reliability; Assembly; Interference; Mechanical sensors; Micromechanical devices; Packaging; Stress; MEMS; low-cost; packaging; pressure sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors (IBERSENSOR), 2014 IEEE 9th Ibero-American Congress on
Conference_Location
Bogota
Print_ISBN
978-1-4799-6835-0
Type
conf
DOI
10.1109/IBERSENSOR.2014.6995521
Filename
6995521
Link To Document