• DocumentCode
    1779929
  • Title

    Pre-breakdown arcing and electrostatic discharge in dielectrics under high DC electric field stress

  • Author

    Andersen, Anders ; Dennison, J.R.

  • Author_Institution
    Mater. Phys. Group, Utah State Univ., Logan, UT, USA
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    Highly disordered insulating materials exposed to high electric fields will, over time, degrade and fail, potentially causing catastrophic damage to devices. Step-up electrostatic discharge (ESD) tests were performed for two common polymer dielectrics, low density polyethylene and polyimide. Pre-breakdown transient current spikes or pre-arcs were observed, using both slow and high speed detection. These pre-ESD discharge phenomena are explained in terms of breakdown modes and defect generation on a microscopic scale. The field at which pre-breakdown arcing begins was compared to the onset field for electrostatic discharge at which complete breakdown begins to occur for each material. We present evidence that these two threshold fields are closely correlated. Thus, important considerations from applications of fields below the maximum field for breakdown may include the material´s defect structure and the field where pre-breakdown arcing begins in a material.
  • Keywords
    arcs (electric); dielectric materials; electric breakdown; electrostatic discharge; polymers; ESD tests; breakdown modes; defect generation; dielectrics; electrostatic discharge; high dc electric field stress; low density polyethylene; material defect structure; polyimide; polymer dielectrics; prebreakdown arcing; prebreakdown transient current; step-up electrostatic discharge; Dielectrics; Electric fields; Electrostatic discharges; Polyimides; arcing; breakdown; charging; dielectric materials; electrostatic discharge; partial discharge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995739
  • Filename
    6995739