DocumentCode :
1780007
Title :
Space charge dynamics in silica-based polyethylene nanocomposites
Author :
Yan Wang ; Chen, Gang ; Vaughan, Alun
Author_Institution :
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
727
Lastpage :
730
Abstract :
Nanodielectrics have been investigated recently as they have shown some improved dielectric properties that are important for high voltage insulation applications. One of these improvements is the reduction in space charge when the nanocomposites are subjected to high dc electric fields. It has been widely reported that the inclusion of nanoparticles in polyethylene can suppress the formation of space charge in the material. However, the detailed mechanisms that are responsible for the charge suppression are not known. In the present paper, charge dynamics in nanosilica based polyethylene nanocomposites have been observed using the pulsed electroacoustic technique. A range of electric fields have been applied to the nanocomposites with different nanosilica loading ratios to investigate the impact of the applied electric field on charge suppression. In addition the effect of surface treatment of nanosilica particles on charge dynamics has also been studied by comparing treated and untreated nanocomposites with the same loading ratio of nanosilica particles. The influence of charge dynamics, especially at higher applied electric fields, on electric breakdown of these nanocomposites has been discussed.
Keywords :
nanocomposites; nanoparticles; polyethylene insulation; pulsed electroacoustic methods; space charge; electric breakdown; high voltage insulation applications; nanosilica based polyethylene nanocomposites; nanosilica loading ratios; nanosilica particles; pulsed electroacoustic technique; silica-based polyethylene nanocomposites; space charge dynamics; space charge reduction; Barium; Bismuth;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
Type :
conf
DOI :
10.1109/CEIDP.2014.6995777
Filename :
6995777
Link To Document :
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