• DocumentCode
    1780052
  • Title

    Dielectric properties of polyimide/boron nitride nanocomposites at high temperature

  • Author

    Diaham, S. ; Saysouk, F. ; Locatelli, M.-L. ; Lebey, T.

  • Author_Institution
    LAPLACE (Lab. Plasma et Conversion d´Energie), Univ. de Toulouse, Toulouse, France
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    687
  • Lastpage
    690
  • Abstract
    The high temperature dielectric properties and electrical conductivity of polyimide/boron nitride (PI/BN) nanocomposite films are investigated as a function of the BN nanofiller size. Whereas in such a temperature range (up to 350 °C) the electrical properties of neat PI are controlled by ionic motions, which make it a semi-insulating material, it has been highlighted the important role of the BN nanofiller size on the reduction of the electrode polarization phenomenon and on the low frequency DC conductivity of PI/BN nanocomposites. Particularly with the smallest BN nanoparticle diameters (95 nm and 40 nm), the dielectric properties changes are strongly attenuated above 200 °C and the DC conductivity is decreased by 1 to 3 orders of magnitude compared to neat PI. For higher nanoparticle diameters (120 nm), the effects are less important. It seems possible to extend the high temperature range of use of PI by using adequate small sizes of BN nanoparticles at low filler content.
  • Keywords
    III-V semiconductors; boron compounds; dielectric polarisation; filled polymers; high-temperature effects; ionic conductivity; nanocomposites; nanoparticles; permittivity; wide band gap semiconductors; BN; dielectric properties; electrical conductivity; electrical properties; electrode polarization phenomenon; ionic motions; low frequency DC conductivity; nanofiller size; nanoparticle; polyimide-boron nitride nanocomposite films; semiinsulating material; size 40 nm; size 95 nm; temperature 350 degC; Conductivity; Dielectrics; Films; Nanocomposites; Nanoparticles; Polyimides; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995801
  • Filename
    6995801