DocumentCode :
1780108
Title :
Barium titanate and the dielectric response of polystyrene-based composites
Author :
Boorman, O. ; Hosier, I.L. ; Praeger, M. ; Torah, Russel ; Vaughan, A.S. ; Andritsch, T. ; Swingler, S.G. ; Topham, J.
Author_Institution :
Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
707
Lastpage :
710
Abstract :
Barium titanate (BaTiO3) is characterized by real permittivity values as high as 10,000, depending upon structure. Consequently, in this work, this material was chosen to serve as a high permittivity filler for polystyrene (PS) based composites. In order to determine the influence of particle dimensions on the permittivity of the composite, the filler size was varied by means of ball milling, from the as-received microscopic filler size, to the mesoscopic and nanometric range. Filler size was measured by scanning electron microscopy (SEM). To explore the influence of fillgrade and particle size on the effective permittivity, a range of different composites was produced and subjected to dielectric spectroscopy. The results obtained were compared with effective medium theories. Since neither the Maxwell Garnet nor Bruggeman equations were able to reproduce the dependency of permittivity on composition seen experimentally, the Lichtenecker Rother equation was chosen and found to provide a good fit for the experimental data.
Keywords :
ball milling; barium compounds; composite insulating materials; dielectric materials; particle size measurement; permittivity; polymer insulators; scanning electron microscopy; spectroscopy; BaTiO3; Bruggeman equations; Lichtenecker-Rother equation; Maxwell Garnet equations; SEM; ball milling; barium titanate; dielectric response; dielectric spectroscopy; fill grade; microscopic filler size; particle size; permittivity values; polystyrene-based composites; scanning electron microscopy; Ball milling; Dielectrics; Dispersion; Loading; Permittivity; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
Type :
conf
DOI :
10.1109/CEIDP.2014.6995830
Filename :
6995830
Link To Document :
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