• DocumentCode
    1780144
  • Title

    A.C. breakdown voltage of solidified alcohol aqueous-solution at 77K

  • Author

    Tsuchiya, R. ; Muramoto, Yoshifumi ; Shimizu, N.

  • Author_Institution
    Dept. of Electr. & Electr. Eng., Meijo Univ., Nagoya, Japan
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    800
  • Lastpage
    803
  • Abstract
    The development of environment-friendly material has been proceeded in many fields. Our laboratory pays attention to electrical insulation system using ice. Ice is environment-friendly material, and it has excellent electrical breakdown strength at cryogenic region. However, it has problem that void or crack is easily formed. Mixture of water-soluble material is considered to prevent formation of void or clack as electrical weak point, and improve A.C. breakdown strength of insulation system using ice. Alcohols are chosen as water-soluble material; namely ethanol, ethylene glycol, 1-propanol, 2-propanol, propylene glycol, 1,3-propanediol and glycerin. These alcohols are easily dissolved in any ratio in water. A.C. breakdown voltage of solidified alcohol aqueous-solutions at 77 K are obtained. A.C. breakdown voltage of solidified alcohol aqueous-solution is higher than that of ice, except in the case of ethanol. Especially 1,3-propanediol aqueous-solution marks the highest, 66% higher value than ice.
  • Keywords
    cracks; electric breakdown; insulation; mixtures; organic compounds; solidification; voids (solid); 1,3-propanediol aqueous solution; 1-propanol; 2-propanol; crack formation prevention; cryogenic region; electrical breakdown strength; electrical insulation system; electrical weak point; environment-friendly material; ethanol; ethylene glycol; glycerin; ice; propylene glycol; solidified alcohol aqueous-solution A.C. breakdown voltage; temperature 77 K; void formation prevention; water-soluble material Mixture; Cooling; Dispersion; Electric breakdown; Electrodes; Ethanol; Ice; Materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995849
  • Filename
    6995849