DocumentCode
1780154
Title
Dielectric studies of polystyrene-based, high-permittivity composite systems
Author
Topham, J. ; Boorman, O. ; Hosier, I.L. ; Praeger, M. ; Torah, Russel ; Vaughan, A.S. ; Andritsch, T. ; Swingler, S.G.
Author_Institution
Electron. & Comput. Sci, Univ. of Southampton, Southampton, UK
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
711
Lastpage
714
Abstract
In this paper, we report on a dielectric study of a series of composite systems based upon a polystyrene matrix (έm ~2.7) containing dispersed particles of lead zirconate titanate (PZT) and barium titanate (BaTiO3) (in both cases, έp ~1000). These components were chosen to give a high dielectric contrast within the system and, because polystyrene is readily etched using permanganic reagents, the size and distribution of particles within the matrix could be readily determined by scanning electron microscopy. We report on the effect of composition on the effective permittivity of the composite; the precise composition of each system was determined by thermogravimetric analysis. The results obtained are compared with theoretical models. We show that, in systems with high dielectric contrast between the matrix and the particles, the variation in relative permittivity with filler loading is best described by the Lichtenecker Rother model.
Keywords
barium compounds; etching; filled polymers; lead compounds; nanocomposites; nanoparticles; particle size; permittivity; scanning electron microscopy; thermal analysis; BaTiO3; Lichtenecker-Rother model; PZT; barium titanate; composition effect; dielectric properties; dispersed particles; etching; filler loading; high permittivity; lead zirconate titanate; nanoparticle size distribution; permanganic reagent; polystyrene-based composite system; scanning electron microscopy; thermogravimetric analysis; Dielectrics; Equations; Loading; Materials; Mathematical model; Permittivity; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995854
Filename
6995854
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