DocumentCode
1780162
Title
Exploratory dielectric study involving ultra-low content of Si-C-Al in epoxy
Author
Frechette, M.F. ; Preda, I. ; Alamdari, H. ; Lewin, P. ; Holt, A. ; Heid, T.
Author_Institution
Inst. de Rech. d´Hydro-Quebec (IREQ), Varennes, QC, Canada
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
756
Lastpage
759
Abstract
Ball milling was used to prepare a mixture of Silicon, Graphite and Aluminum, in equal proportion. X-ray analysis (XRD) confirmed that SiC was not produced in the present milling conditions. Aluminum was identified as being partially oxidized. The powder microstructure was found to be rather micrometric in size. Epoxy samples were casted using the Si-C-Al powder as an additive. Neat epoxy and a composite containing 0.1 wt% of the filler were prepared. A series of dielectric tests were performed in order to compare the behavior of neat and composite epoxy. Dielectric responses at 20°C were found to be very similar, whether the excitation field was low or high. However, erosion experiments have allowed to discriminate the performance of the samples, with a definite worsened resistance to discharges from the composite sample.
Keywords
X-ray diffraction; additives; aluminium; ball milling; carbon; filled polymers; materials preparation; permittivity; resins; silicon; Al; C; Si; Si-C-Al powder; X-ray analysis; XRD; ball milling; composite epoxy; dielectric responses; dielectric tests; neat epoxy; powder microstructure; Aluminum; Dielectrics; Electric fields; Permittivity; Powders; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995858
Filename
6995858
Link To Document