Thermal breakdown modeling in polyimide films considering different conduction models

The theoretical thermal breakdown in polyimide (PI) films is modeled at very high temperature between 300 °C and 340 °C using the heat balance equation. Its value is extracted from the internal temperature rise versus electric field of the sample up to its thermal degradation. In our previous work, a particular attention was paid to the determination of all the experimental thermal parameters (heat capacity versus temperature and thermal conductivity). However and in a first approach, a simple thermal-activated current density was used to solve the heat balance equation. The present paper shows an update of our modeling results considering the more accurate hopping conduction current mechanisms occurring in PI. New estimation of the theoretical thermal breakdown fields are calculated in the different cases and will be confronted with the experimental ones.