DocumentCode :
1780243
Title :
Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method
Author :
Yanhui Huang ; Krentz, Timothy M. ; Nelson, J.K. ; Schadler, Linda S. ; Yang Li ; He Zhao ; Brinson, L. Catherine ; Bell, Michael ; Benicewicz, Brian ; Ke Wu ; Breneman, Curt M.
Author_Institution :
Dept. of Mater. Sci. & Eng., Rensselaer Polytech. Inst., Troy, NY, USA
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
748
Lastpage :
751
Abstract :
Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.
Keywords :
composite materials; dielectric materials; dielectric relaxation; epoxy insulation; finite element analysis; transmission electron microscopy; TEM image; bimodal brush functionalized epoxy nanodielectric; composite filler distribution; dielectric property; dielectric spectra simulation; epoxy compatible chain; finite element 2D analysis method; fitting parameters; graft density; interface dielectric relaxation behavior prediction; interface property impact; interfacial area; model geometry; modeling method; short molecule; silica; Equations; Manganese; Mathematical model; Tuning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
Type :
conf
DOI :
10.1109/CEIDP.2014.6995897
Filename :
6995897
Link To Document :
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