Title :
A way to prepare nano-Ag/epoxy resin composite and study of LSPR in composite
Author :
Kai Wu ; Jinhua Dong ; Zhihui Shao ; Man Ding
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
Abstract :
Comparing to the base epoxy resin, nano-composites usually have enhanced mechanical, thermal and electrical properties, and a lot of technology was introduced to get high quality nano-composites. In this work, Ag nanoparticles have been synthesized by using ethanol (and DMF) as reducing agent and solvent in the presence of ultraviolet radiation and polyvinyl pyrrolidone. The particle size can be controlled by changing the time of radiation and the concentration of silver nitrate. Localized surface plasmon resonacnces (LSPR) of colloidal Ag nanoparticles were observed by UV-visible absorption spectra, and the absorption peak position is determined by the size and shape of Ag nanoparticles. After mixing the ethanol containing Ag NPS into epoxy resin, and then removing the solvent by the method of reduced pressure distillation, cured Ag/epoxy resin nanocomposites were well prepared. It is confirmed that the LSPR of Ag NPS still exist in the composites and its UV-visible absorption spectra is tunable by choosing Ag NPS with different size and shape.
Keywords :
colloidal crystals; curing; distillation; mixing; nanocomposites; nanofabrication; nanoparticles; particle size; resins; silver; surface plasmon resonance; ultraviolet radiation effects; ultraviolet spectra; visible spectra; Ag; LSPR; UV-visible absorption spectra; absorption peak position; base epoxy resin; colloidal Ag nanoparticles; curing; localized surface plasmon resonacnces; mixing; nanoAg-epoxy resin composite preparation; nanocomposites; particle size; polyvinyl pyrrolidone; radiation time; reduced pressure distillation method; ultraviolet radiation; Absorption; Epoxy resins; Ethanol; Nanocomposites; Shape; Silver; Solvents; Ag NPS; LSPR; UV; composition; epoxy resin;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
DOI :
10.1109/CEIDP.2014.6995904