Title :
Effects of filler distribution on morphology and thermal conductivity of polymer composites
Author :
Vanga-Bouanga, C. ; Savoie, S. ; Frechette, M.F. ; David, E.
Author_Institution :
Inst. de Rech. d´Hydro-Quebec (IREQ), Varennes, QC, Canada
Abstract :
The dielectric properties of the composite samples were characterized using dielectric spectroscopy in a wide range of frequencies (10-2 Hz - 1 MHz) at temperatures ranging from 20 to 200 °C. The real part of the dielectric permittivity of a microcomposite containing 50 wt% of BN was found to be close to that of the PE matrix value (about 2.5) at 0.1 Hz after water removal. Thermal conductivity of PE was greatly improved: after a high-milling time, it increased by about 50% in comparison with the pure matrix. The study of the AC breakdown voltage has indicated a decrease when high-milling time was used. On the opposite, when short-milling time was used, a slight increase in breakdown was observed. This could be attributed to the defects and the possible contamination of composite by the crucible-balls. Scanning Electron Microscopy has been used to investigate the morphology of PE-BN films to evaluate the dispersion of BN.
Keywords :
III-V semiconductors; boron compounds; dielectric thin films; electric breakdown; filled polymers; milling; permittivity; scanning electron microscopy; semiconductor doped polymers; thermal conductivity; wide band gap semiconductors; AC breakdown voltage; BN; BN dispersion; SEM; composite contamination; crucible-balls; dielectric permittivity; dielectric spectroscopy; filler distribution effects; film morphology; frequency 0.01 Hz to 1 MHz; microcomposite; milling time; polymer composites; scanning electron microscopy; temperature 20 degC to 200 degC; thermal conductivity; water removal; Conductivity; Dielectrics; Electric breakdown; Heating; Milling; Permittivity; Thermal conductivity;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
DOI :
10.1109/CEIDP.2014.6995910