DocumentCode
1781759
Title
Re-inventing electronic and opto-electronic co-integration to deliver the next generation of parallel optics interconnects
Author
Raz, Oded ; Duan, Pinxiang ; Dorren, H.J.S.
Author_Institution
Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2014
fDate
6-10 July 2014
Firstpage
1
Lastpage
4
Abstract
With the exponential growth of data centers, in terms of number of hosts and capacity, the required components for building data center networks are stretched to their limits. In this talk we will discuss a new technology developed for interconnecting electronic and opto-electronic ICs in order to revolutionize the way parallel optics are fabricated and packaged so that demands in terms of cost, power, density and performance can be met well into the 3rd decade of the 21st century.
Keywords
computer centres; integrated optoelectronics; optical interconnections; data center; electronic co-integration; opto-electronic co-integration; parallel optics interconnects; CMOS integrated circuits; Integrated optics; Optical fibers; Power demand; Three-dimensional displays; Vertical cavity surface emitting lasers; VCSEL; data center; datacom; integration; packaging; parallel-optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Transparent Optical Networks (ICTON), 2014 16th International Conference on
Conference_Location
Graz
Type
conf
DOI
10.1109/ICTON.2014.6876442
Filename
6876442
Link To Document