• DocumentCode
    1781759
  • Title

    Re-inventing electronic and opto-electronic co-integration to deliver the next generation of parallel optics interconnects

  • Author

    Raz, Oded ; Duan, Pinxiang ; Dorren, H.J.S.

  • Author_Institution
    Eindhoven Univ. of Technol., Eindhoven, Netherlands
  • fYear
    2014
  • fDate
    6-10 July 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    With the exponential growth of data centers, in terms of number of hosts and capacity, the required components for building data center networks are stretched to their limits. In this talk we will discuss a new technology developed for interconnecting electronic and opto-electronic ICs in order to revolutionize the way parallel optics are fabricated and packaged so that demands in terms of cost, power, density and performance can be met well into the 3rd decade of the 21st century.
  • Keywords
    computer centres; integrated optoelectronics; optical interconnections; data center; electronic co-integration; opto-electronic co-integration; parallel optics interconnects; CMOS integrated circuits; Integrated optics; Optical fibers; Power demand; Three-dimensional displays; Vertical cavity surface emitting lasers; VCSEL; data center; datacom; integration; packaging; parallel-optics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transparent Optical Networks (ICTON), 2014 16th International Conference on
  • Conference_Location
    Graz
  • Type

    conf

  • DOI
    10.1109/ICTON.2014.6876442
  • Filename
    6876442