DocumentCode :
1781963
Title :
Generalized Debye model for PCB dielectrics and conductors
Author :
Engin, A. Ege ; Kozachenko, Eva
Author_Institution :
Dept. of Electr. & Comput. Eng., San Diego State Univ., San Diego, CA, USA
fYear :
2014
fDate :
12-16 May 2014
Firstpage :
97
Lastpage :
100
Abstract :
Electromagnetic (EM) simulators are commonly used for electromagnetic compatibility and signal integrity (SI) analysis of printed circuit boards (PCB). The accuracy of such analysis depends on the models used for PCB dielectrics and conductors. These models should be broadband and preserve the physical properties of the materials, such as causality and passivity. One such model for dielectrics is the Debye model. Conductors have typically been modeled using a simple surface impedance formula, which is accurate for smooth conductors and small skin depth. With the evolution of high-speed designs, surface roughness loss has also become increasingly important for signal integrity of PCB interconnects. In this paper, we propose a Debye-like model for conductors possibly having rough surfaces. The advantages of a Debye model are its flexibility for arbitrary variation of surface roughness; guaranteed passivity in SI analysis; and availability of an equivalent circuit representation.
Keywords :
conductors (electric); electromagnetic compatibility; equivalent circuits; printed circuit interconnections; skin effect; surface roughness; PCB conductors; PCB dielectrics; PCB interconnects; electromagnetic compatibility; electromagnetic simulators; equivalent circuit representation; generalized Debye model; printed circuit boards; signal integrity analysis; simple surface impedance formula; small skin depth; smooth conductors; surface roughness loss; Conductors; Impedance; Integrated circuit modeling; Rough surfaces; Surface impedance; Surface roughness; Vectors; Debye model; skin effect; surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location :
Tokyo
Type :
conf
Filename :
6997081
Link To Document :
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