• DocumentCode
    178201
  • Title

    Automatic removal of EEG artifacts using electrode-scalp impedance

  • Author

    Yuan Zou ; Dehzangi, Omid ; Nathan, Viswam ; Jafari, Roozbeh

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2014
  • fDate
    4-9 May 2014
  • Firstpage
    2054
  • Lastpage
    2058
  • Abstract
    Due to the low signal-to-noise ratio of electroencephalographic (EEG) recordings, the quality of the electrode-scalp contact is an important factor in EEG-based brain-computer interfaces (BCIs). For this reason, the impedance between each individual electrode and the scalp is measured prior to each EEG recording session. In order to obtain high quality EEG signals and accurate performance, the impedance has to be low (below 5K Ohms). Typically, researchers have reduced the electrode-scalp impedance by performing time-consuming electrode adjustments prior to the data acquisition stage. In this paper, we utilize the electrode-scalp impedance information to remove the EEG artifacts caused by high impedance electrodes in order to enhance the signal quality during the signal processing stage. Our proposed method is based on the independent component analysis (ICA) algorithm, which is used to decompose the EEG signals into independent components. The electrode-scalp impedance is employed to automatically distinguish irrelevant components from event-related components. The experimental results show that our method can effectively remove artifacts and enhance the BCI performance compared to the scenario where no artifacts were removed, and the scenario in which irrelevant independent components were removed manually based on prior knowledge.
  • Keywords
    biomedical electrodes; brain-computer interfaces; data acquisition; electroencephalography; independent component analysis; medical signal processing; BCI; EEG artifact automatic removal; EEG-based brain-computer interfaces; ICA algorithm; data acquisition stage; electrode adjustments; electrode-scalp contact quality; electrode-scalp impedance; electroencephalographic recording; event-related components; high impedance electrodes; independent component analysis algorithm; signal processing stage; signal quality; signal-to-noise ratio; Acoustics; Conferences; Speech; Speech processing; EEG; Electrode-scalp impedance; ICA;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Acoustics, Speech and Signal Processing (ICASSP), 2014 IEEE International Conference on
  • Conference_Location
    Florence
  • Type

    conf

  • DOI
    10.1109/ICASSP.2014.6853960
  • Filename
    6853960