• DocumentCode
    1782110
  • Title

    Evaluation and analysis of electromagnetic noise coupling in a board with a mixed signal IC

  • Author

    Tsukamoto, Kenta ; Iwanami, Mizuki ; Hankui, Eiji

  • Author_Institution
    Green Platform Res. Labs., NEC Corp., Kawasaki, Japan
  • fYear
    2014
  • fDate
    12-16 May 2014
  • Firstpage
    358
  • Lastpage
    361
  • Abstract
    In wireless communication terminal such as smart mobile devices, a countermeasure for electromagnetic noise generated by digital circuits becomes more important since it´s coupling to an antenna causes degradation of communication performance. To apply an optimum countermeasure, it is very important to find out correctly a noise coupling path. This paper gives evaluation results of noise coupling to an antenna in a test board with a RF and digital mixed IC using the amplitude probability distribution (APD) measurement method. We analytically investigated noise coupling path to an antenna utilizing a correlation coefficient suitable for the APD curve for the test board. Moreover, in order to verify analyzed results the noise coupling path in the test board was evaluated by measurements of In-phase/Quadrature (I/Q) signals.
  • Keywords
    antennas; electromagnetic compatibility; electromagnetic coupling; integrated circuit noise; integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; APD method; I/Q signals; RFIC; amplitude probability distribution measurement method; antenna; correlation coefficient; digital circuits; digital mixed IC; electromagnetic noise coupling; in-phase-quadrature signal measurements; mixed signal IC; noise coupling path; test board; wireless communication terminal; Antenna measurements; Antennas; Couplings; Integrated circuits; Noise; Radio frequency; Receivers; APD; Amplitude Probability Distribution; I/Q signal; intra-EMC; noise coupling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6997152