• DocumentCode
    1782148
  • Title

    SI/PI Co-simulation including voltage regulating circuitry for high-performance multi-chip package

  • Author

    JuHwan Lim ; Jongjoo Lee ; SoYoung Jung

  • Author_Institution
    Samsung Electron., Hwasung, South Korea
  • fYear
    2014
  • fDate
    12-16 May 2014
  • Firstpage
    366
  • Lastpage
    369
  • Abstract
    As new NAND specification such as Toggle 2.0 has been standardized and developed, supply voltage has been reduced from 3.3V to 1.8V because of the adoption of high-speed I/O. Accordingly, due to issues of the backward compatibility with previous specifications and the power budget, voltage regulator implemented in a package should supply the power to the I/Os. In this paper, we propose the advanced SI/PI co-simulation methodology including voltage regulator circuitry for high-performance multi-chip packages. It is shown that the proposed simulation can detect the vulnerability of PDN related to the output of voltage regulator in the design stage of high-perfomance multi-chip packages, and can help optimize PCB design including PDN. It is also shown that the simulation are in good agreement with measurements.
  • Keywords
    multichip modules; printed circuit design; voltage regulators; NAND specification; PCB design; high-performance multichip package; voltage regulating circuitry; voltage regulator; Flash memories; Integrated circuit modeling; Jitter; Regulators; Semiconductor device measurement; Silicon; Voltage control; low drop out (LDO); multi-chip package (MCP); power distribution network (PDN); redistribution layer (RDL);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6997171