DocumentCode :
1782148
Title :
SI/PI Co-simulation including voltage regulating circuitry for high-performance multi-chip package
Author :
JuHwan Lim ; Jongjoo Lee ; SoYoung Jung
Author_Institution :
Samsung Electron., Hwasung, South Korea
fYear :
2014
fDate :
12-16 May 2014
Firstpage :
366
Lastpage :
369
Abstract :
As new NAND specification such as Toggle 2.0 has been standardized and developed, supply voltage has been reduced from 3.3V to 1.8V because of the adoption of high-speed I/O. Accordingly, due to issues of the backward compatibility with previous specifications and the power budget, voltage regulator implemented in a package should supply the power to the I/Os. In this paper, we propose the advanced SI/PI co-simulation methodology including voltage regulator circuitry for high-performance multi-chip packages. It is shown that the proposed simulation can detect the vulnerability of PDN related to the output of voltage regulator in the design stage of high-perfomance multi-chip packages, and can help optimize PCB design including PDN. It is also shown that the simulation are in good agreement with measurements.
Keywords :
multichip modules; printed circuit design; voltage regulators; NAND specification; PCB design; high-performance multichip package; voltage regulating circuitry; voltage regulator; Flash memories; Integrated circuit modeling; Jitter; Regulators; Semiconductor device measurement; Silicon; Voltage control; low drop out (LDO); multi-chip package (MCP); power distribution network (PDN); redistribution layer (RDL);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location :
Tokyo
Type :
conf
Filename :
6997171
Link To Document :
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