Title :
Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC
Author :
Eunseok Song ; Jung, Daniel H. ; Youngwoo Kim ; Joungho Kim
Author_Institution :
Dept. of Electr. Eng., Terahertz Interconnection & Package Lab., Daejeon, South Korea
Abstract :
To overcome power distribution network (PDN) design challenges such as serious power noise, large system area burden, the wireless power transfer (WPT) system in the 3D package and IC is applied. In this study, the 3D multi-helix inductor is proposed for designing the 3D package and IC with a WPT scheme and an equivalent circuit modeling is also implemented. The fabricated package WPT system represents a voltage transfer ratio (VTR) of 77.4 % and a system-level power efficiency of 53.0 %. The wireless PDN impedance is analyzed to verify the performance of the 3D package and IC with a WPT scheme in terms of SSN. It shows excellent performance in terms of SSN because the DC voltage output section of the rectifier of the WPT system can be assumed as voltage regulator module (VRM). Also, it has a characteristic of a band-pass filter (BPF), which passes resonance frequencies only due to the magnetic field resonance characteristic of WPT. Thus, the 3D package and IC with a WPT scheme becomes an excellent PDN solution that can reduce such system area burden and power noise at the same time.
Keywords :
band-pass filters; equivalent circuits; inductive power transmission; integrated circuit design; integrated circuit modelling; integrated circuit packaging; magnetic resonance; radiofrequency power transmission; 3D multihelix inductor; 3D package; BPF; DC voltage output section; IC design; PDN design; SSN; VRM; VTR; band-pass filter; efficiency 53.0 percent; equivalent circuit modeling; magnetic field resonance; magnetic field resonance characteristic; package WPT system; power noise; rectifier; system-level power efficiency; voltage regulator module; voltage transfer ratio; wireless PDN impedance; wireless power distribution network analysis; wireless power distribution network measurement; wireless power transfer; Impedance; Inductors; Integrated circuits; Magnetic fields; Noise; Three-dimensional displays; Wireless communication; 3D package and IC; inductor design; magnetic field; power efficiency; resonance; simultaneous switching noise; wireless power distribution network; wireless power transfer;
Conference_Titel :
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location :
Tokyo