Title :
Design of compact and low-EMI waveguide structures based on through glass vias
Author :
Xing-Chang Wei ; Xiao-Juan Wang ; De-Cao Yang ; Jun Li ; Xin Wei
Author_Institution :
Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China
Abstract :
In this paper, two kinds of compact waveguide structures based on through glass vias (TGVs) technology are proposed. A full-wave simulator on the basis of finite element method is applied to analyze the transmission characteristics of these structures. The return loss S11, transmission S21 and electric field distribution results show that they have the similar signal transmission performance of the traditional full waveguide structures. The air filled TGVs are employed in the proposed waveguides. Simulation results show that these air filled vias can concentrate electromagnetic field within the waveguides, and hence reduce the electromagnetic interference.
Keywords :
electromagnetic fields; electromagnetic interference; finite element analysis; three-dimensional integrated circuits; TGV technology; air filled vias; compact EMI waveguide structures; electric field distribution; electromagnetic field; electromagnetic interference; finite element method; full-wave simulator; low-EMI waveguide structures; return loss; signal transmission; through glass vias technology; transmission characteristics; transmission distribution; Electric fields; Glass; Optical waveguides; Planar waveguides; Silicon; Substrates; Low-EMI; TGV; compact waveguide structure;
Conference_Titel :
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location :
Tokyo
