DocumentCode
1782593
Title
Integrated cross-layer solutions for enabling silicon photonics into future chip multiprocessors
Author
Grani, Paolo ; Bartolini, Sandro ; Furdiani, Emanuele ; Ramini, Luca ; Bertozzi, Davide
Author_Institution
Dept. of Inf. Eng. & Math. Sci., Univ. of Siena, Rome, Italy
fYear
2014
fDate
17-19 Sept. 2014
Firstpage
1
Lastpage
8
Abstract
Nanophotonic is a promising solution for interconnections in future chip multiprocessors (CMPs) due to its intrinsic low-latency and low-power features. This paper proposes an integrated approach with physical level design choices to select the most suitable optical network topology, and an adhoc software strategy to improve performance and reduce energy consumption of a tiled CMP architecture. We adopt an all-optical reconfigurable network which has been designed to significantly reduce path-setup latency and energy consumption. Specifically the optimization aims at distributing the traffic into the Network on Chip (NoC) in such a way to limit resurce usage conflicts (during path-setups) and have a more uniform utilization of the fast optical resources. On-chip photonics indeed is the key enabler for such a strategy permitting to reach even far destinations with a reduced latency, the same as the closest ones. We investigate performance/power consumption effects on a CMP system and we compare against both a high-performance electronic folded Torus NoC and the standard optical reconfigurable architecture. The optical network improves 7% on average over the electronic counterpart and, especially when using the dedicated software optimization for matching application locality and network features, it reaches about 26% average execution time improvement.
Keywords
elemental semiconductors; low-power electronics; multiprocessor interconnection networks; nanophotonics; network topology; network-on-chip; reconfigurable architectures; silicon; Si; adhoc software; all-optical reconfigurable network; chip multiprocessor interconnections; energy consumption; high-performance electronic folded Torus NoC; integrated cross-layer solutions; low-latency features; low-power features; nanophotonics; network on chip; on-chip photonics; optical network topology; optical reconfigurable architecture; optical resources; path-setup latency; physical level design; silicon photonics; software optimization; tiled CMP architecture; Optical fiber networks; Optical losses; Optical switches; Optimization; Propagation losses; Software; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2014 19th International
Conference_Location
Porto Alegre
Type
conf
DOI
10.1109/IMS3TW.2014.6997403
Filename
6997403
Link To Document