DocumentCode
1782637
Title
Aluminium nitride films on glass
Author
Desideri, Daniele ; Cavallin, Tommaso ; Maschio, Alvise ; Belloni, Matteo Poggeschi
Author_Institution
Dept. of Ind. Eng., Univ. of Padova, Padua, Italy
fYear
2014
fDate
12-15 Oct. 2014
Firstpage
92
Lastpage
95
Abstract
Purpose of this work is to realize AlN films with preferred crystal orientation on a magnetron sputtering system at different pressure values, in particular towards low-pressure gas discharge operative range, where few data are available in literature. In this respect, explored operative pressures have been 0.07 and 0.12 Pa, together with the more common values of 0.3 and 0.7 Pa. Reactive Ar-N2 mixtures (50%-50% and 0%-100%) and a DC-pulsed power supply have been used, and films have been deposited on glass substrate. Films thicknesses have been measured with surface profiler, and XRD analyses have been performed. Experimental data are presented; the best results with respect to adhesion, deposition rate and film crystallinity with the same deposition time have been obtained with mixtures 50% Ar - 50% N2 at 0.12 and 0.3 Pa.
Keywords
III-V semiconductors; X-ray diffraction; adhesion; aluminium compounds; mixtures; semiconductor growth; semiconductor thin films; sputter deposition; texture; wide band gap semiconductors; AlN; DC pulsed power supply; SiO2; XRD analysis; adhesion; aluminium nitride films; deposition rate; film crystallinity; film thickness; glass substrate; low-pressure gas discharge; magnetron sputtering system; preferred crystal orientation; pressure 0.3 Pa to 0.7 Pa; reactive argon-nitrogen mixtures; surface profiler; Cathodes; Diffraction; Magnetic analysis; Magnetic films; Sputtering; X-ray scattering; aluminium nitride; low pressure; magnetron sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference (NMDC), 2014 IEEE 9th
Conference_Location
Aci Castello
Type
conf
DOI
10.1109/NMDC.2014.6997430
Filename
6997430
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