DocumentCode :
1782653
Title :
Comparative study of AlN/GaN HEMT and MOSHEMT structures by varying oxide thickness
Author :
Swain, R. ; Jena, K. ; Gaini, A. ; Lenka, T.R.
Author_Institution :
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol. Silchar, Silchar, India
fYear :
2014
fDate :
12-15 Oct. 2014
Firstpage :
128
Lastpage :
131
Abstract :
In this paper four possible structures of AlN/GaN HEMT and MOSHEMT have been investigated through extensive simulation by varying both oxide and AlN barrier layer thickness under the Gate Foot region. DC and RF characteristics are obtained and studied. Almost zero gate to source current is obtained in case of MOSHEMT structures which makes this device promising for low power applications. However, the HEMT structure possesses high gate capacitance of 40fF/μm and transconductance of 1.1mS/μm.
Keywords :
III-V semiconductors; MOSFET; aluminium compounds; capacitance; electric admittance; gallium compounds; high electron mobility transistors; semiconductor device models; wide band gap semiconductors; AlN barrier layer thickness; AlN-GaN; AlN-GaN HEMT structure; DC characteristics; MOSHEMT structure; RF characteristics; extensive simulation; gate capacitance; gate foot region; low power applications; oxide thickness; transconductance; Gallium nitride; HEMTs; III-V semiconductor materials; Logic gates; MODFETs; Silicon compounds; Transconductance; AlN/GaN; Gate Foot; HEMT; MOSHEMT; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2014 IEEE 9th
Conference_Location :
Aci Castello
Type :
conf
DOI :
10.1109/NMDC.2014.6997439
Filename :
6997439
Link To Document :
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