DocumentCode :
1783007
Title :
A systematic approach to modeling impedances and current distribution in planar magnetics
Author :
Chen, Mei ; Araghchini, Mohammad ; Afridi, Khurram ; Lang, Jeffrey H. ; Sullivan, C.R. ; Perreault, David J.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2014
fDate :
22-25 June 2014
Firstpage :
1
Lastpage :
17
Abstract :
Planar magnetic components using printed-circuit-board windings are attractive due to their high repeatability, good thermal performance and usefulness for realizing intricate winding patterns. To enable higher system integration at high switching frequency, more sophisticated methods that can rapidly and accurately model planar magnetics are needed. This paper develops a lumped circuit model that captures the impact of skin and proximity effects on current distribution and electromagnetic fields in planar magnetics. This enables accurate predictions of impedances, losses, stored reactive energy and current sharing among parallel windings. This lumped model is also a circuit domain representation of electromagnetic interactions. It can be used to simulate circuits incorporating planar magnetics, to visualize the electromagnetic fields, and to extract parameters for magnetic models by simulations. The modeling results match with previous theories and finite-element-modeling results. A group of planar magnetic devices, including transformers and inductors with various winding patterns, are prototyped and measured to validate the proposed approach.
Keywords :
current distribution; electromagnetic fields; finite element analysis; magnetic devices; printed circuits; transformer windings; circuit domain representation; current distribution; current sharing; electromagnetic fields; finite-element-modeling; impedance modeling; inductors; lumped circuit model; magnetic models; planar magnetic components; planar magnetic devices; printed-circuit-board windings; stored reactive energy; switching frequency; thermal performance; transformers; Computational modeling; Integrated circuit modeling; Magnetics; Mathematical model; Surface impedance; Windings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control and Modeling for Power Electronics (COMPEL), 2014 IEEE 15th Workshop on
Conference_Location :
Santander
Type :
conf
DOI :
10.1109/COMPEL.2014.6877143
Filename :
6877143
Link To Document :
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