Title :
A 25W X-band GaN PA in SMT package
Author_Institution :
M/A-COM Technol. Solutions, Belfast, UK
Abstract :
A single stage X-band (9-10GHz) PA module has been developed using a discrete 0.25um GaN transistor with 4.8mm gate periphery, that incorporates input and output matching via discrete substrates in package. The initial demonstrator module achieves 25W of power under pulsed conditions at 9.5-10GHz with Vds=50V, a peak efficiency of 41% and small signal gain of around 12dB. The PA was assembled in a 6mm overmolded QFN package. The power density and peak drain efficiency are in reasonable agreement with the process pcm performance at this frequency, given output matching losses have to be accounted for. This work demonstrates for the first time the feasibility of prematched GaN transistors and MMIC-like modules in high volume SMT packaging and to a frequency of 10GHz.
Keywords :
III-V semiconductors; MMIC power amplifiers; gallium compounds; losses; microwave power transistors; pulse code modulation; surface mount technology; wide band gap semiconductors; GaN; MMIC-like modules; discrete substrate transistor; efficiency 41 percent; frequency 9 GHz to 10 GHz; gate periphery; high volume SMT packaging; initial demonstrator module; input and output matching; output matching losses; overmolded QFN package; peak drain efficiency; power 25 W; power density; process PCM performance; pulsed conditions; single stage X-band PA module; size 0.25 mum; small signal gain; voltage 50 V; Gain; Gallium nitride; Impedance matching; Load modeling; MMICs; Microwave amplifiers; Solid modeling; GaN HEMT; MMIC; Power Amplifier;
Conference_Titel :
European Microwave Integrated Circuit Conference (EuMIC), 2014 9th
Conference_Location :
Rome
DOI :
10.1109/EuMIC.2014.6997876