DocumentCode
1783492
Title
Innovative engineering outreach using Intel® security and embedded tools
Author
Kannavara, Raghudeep ; Schaumont, Patrick ; Maniatakos, Michail ; Smith, Michael A. ; Buck, Scott
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
2014
fDate
14-16 May 2014
Firstpage
127
Lastpage
132
Abstract
During Spring 2013, the Evaluation Platforms Program from Intel and the Intel Software and Services Group donated Intel® Atom™ processor based development kits to the Electrical and Computer Engineering (ECE) Departments at Virginia Tech University and Polytechnic Institute of New York University (NYU Poly). The goal was to enable engineering faculty to develop projects based on Intel® security and embedded tools. The projects thus developed, key learnings and project outcomes are elucidated in this paper. Further, we evaluate the outreach projects to highlight the two different, yet important approaches to security curriculum development emphasizing security engineering versus security attacks.
Keywords
computer science education; embedded systems; innovation management; microprocessor chips; security of data; ECE departments; Intel Atom processor based development kits; Intel Software and Services Group; Intel embedded tools; Intel security tools; NYU Poly; Polytechnic Institute of New York University; Virginia Tech University; electrical and computer engineering departments; engineering faculty; evaluation platform program; innovative engineering outreach; security curriculum development; Elliptic curve cryptography; Law; Libraries; NIST; Computer Security; Embedded Platforms; Engineering Outreach; Intel® AtomTM Processors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Education (EWME), 10th European Workshop on
Conference_Location
Tallinn
Type
conf
DOI
10.1109/EWME.2014.6877411
Filename
6877411
Link To Document